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2026 CIOE Concludes Successfully | DYS Showcases High-Speed Optical Passive Components for AI Computing
Release time:
2026-09-11
September 11, 2026 – The 27th China International Optoelectronic Exposition (CIOE) came to a successful close at Shenzhen World Exhibition & Convention Center (Bao’an). DYS Fiber Optic exhibited at Booth 9A22, Hall 9, presenting a full portfolio of high-speed optical passive components tailored for AI computing scenarios, and engaged in in-depth communications with customers and partners across the industry.
As a professional manufacturer of optical passive components with 17 years of manufacturing experience, DYS displayed a lineup of core product solutions at the show: FAU & PM fiber jumpers for multi-channel fiber interconnection to unlock AI computing density; SHUFFLE solutions delivering one-stop high-density fiber interconnection for data centers; MPO/MTP® cable assemblies for high-density cabling in data centers; and MMC & SN®-MT cable assemblies for high-density pre-terminated interconnection. The product portfolio covers cutting-edge applications including AI computing and high-speed interconnection in data centers, drawing numerous visitors for on-site consultation and business discussions.
During the exhibition, the DYS team introduced the technical merits and custom manufacturing capabilities of our products to guests. With a mature production system and continuous technology innovation, DYS provides reliable high-speed fiber interconnection products and one-stop customized services for customers in AI computing and data center industries.
The successful conclusion of CIOE marks a new starting point. Moving forward, DYS will keep focusing on R&D of high-speed optical interconnection technology, continuously upgrade product solutions, and cooperate with industry partners to boost the high-quality development of computing infrastructure.
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