Application

1：AI Supercomputing Clusters

Supports large‑scale GPU computing networking to realize orderly optical‑path re‑arrangement among multiple nodes. It enables

ultra‑large‑bandwidth and low‑latency data exchange for computing workloads and meets cabling requirements for networking of

millions‑level computing cards.

2：Large‑scale Data Centers (AIDC/IDC)

Performs optical‑path transition, signal aggregation and routing reconfiguration between Leaf and Spine switches under leaf‑spine

network architecture. It simplifies data‑center cabling infrastructure and improves cabinet space utilization.

3：CPO Co‑Packaged Optics Systems

Matches and re‑configures optical paths for opto‑electronic integrated switches and high‑speed optical module arrays. It optimizes

board‑level and cabinet‑level optical interconnection layout and significantly reduces equipment footprint.

4：High‑Performance Computing (HPC) Centers

Delivers stable, well‑organized high‑density fiber interconnection solutions for supercomputing systems. It lowers cabling‑related failure

risks and guarantees long‑term stable operation of supercomputing hardware.

5：High‑speed DCI Data Interconnection Scenarios

Enables high‑speed optical‑path scheduling and signal re‑organization across equipment and computer rooms, compatible with long‑haul,

large‑bandwidth optical‑data transmission.

6：Custom High‑density Optical Cabling Projects

Supports new‑build and retrofitting projects with customized optical‑topology cabling for government‑enterprise private networks, high‑end

communication base stations, smart computing parks and other use cases.

Features

1：Passive zero‑power‑loss design for high stability and reliability

Adopting purely passive optical‑path architecture with no chips or circuits and requiring no power supply. It eliminates electromagnetic interference, provides stable optical transmission, ultra‑low insertion loss and zero signal latency, and supports 7×24‑hour continuous operation.

2：High‑density integration for maximum space savings

The integrated enclosure embeds pre‑defined fiber re‑routing paths, replacing hundreds of discrete jumpers. Compared with conventional cabling schemes, it saves over 70 % of cabling space, optimizes cabinet air‑flow and improves heat dissipation within data centers.

3：Standardized optical‑path re‑mapping with zero on‑site commissioning cost

Precise optical‑path mapping relationships are pre‑configured at factory, with 100 % full‑channel testing and calibration. Plug‑and‑play on site without core‑by‑core manual tuning, substantially shortening project deployment cycles while reducing human‑induced cabling errors and failure risks.

4：Robust mechanical construction for demanding operating conditions

Housing options include aluminum alloy / galvanized steel sheet (customizable). The enclosed enclosure is dust‑proof, oxidation‑resistant, vibration‑resistant and anti‑interference, protecting internal fibers and adapting to long‑term constant‑temperature‑and‑humidity environments plus equipment vibration in data‑center premises.

5：Modular and expandable with broad compatibility

Available in standard 1U/2U/3U/4U rack‑mount dimensions. Customizable fiber counts and optical topologies are supported. Stackable installation is allowed, and it is compatible with mainstream multi‑fiber connectors such as MPO and MT, working with most high‑speed optical modules and switches.

6：Easy‑to‑maintain design with low failure rate for cost‑efficiency

Integrated orderly cabling eliminates tangled and misrouted jumpers. Troubleshooting during later‑stage operation‑and‑maintenance is simplified, cutting maintenance costs and line‑failure probability and improving overall network stability.